The market of Micro-Electro-Mechanical Systems (MEMS) is estimated to an annual growth of 16% between 2004 and 2009 to an annual turnover of $56 billion. The widespread development of non silicon multifunctional MEMS is now linked to the development of new manufacturing routes which tackle the main drivers faced by the end-users:

• cost reduction
• miniaturisation
• massive integration of functions

The current generation of mass-marketed non-silicon micro devices is mainly obtained by classical replication processes, micro injection and to a lesser extent hot embossing of polymer materials. The additional steps from material to product, namely functionalisation, cutting, assembly, but even quality controls are considered as other building blocks and therefore implemented more or less independently along the process chain. This type of manufacturing process does not offer possibilities to build very complex multi functional 3D parts and are not suitable for inorganic materials (ceramics, metals). Consequently, for very complex multifunctional ceramics 3D complex parts a solution for mass marketing has still to be developed.

Example of multilayer 3D parts with embedded channels and conductor 3D representation of Murata's hybrid module in LTCC (Source: "Microwave Engineering Europe, Aug/Sep 97)

The MULTILAYER project ambition is to develop a new platform for the large-scale production of micro devices based on a technology we call “Rolled multi material layered 3D shaping technology” using the concept of tape casting and advanced printing techniques. The set-up and the feasibility of mass manufacturing will be assessed. This technology will enable the high-throughput manufacturing of complex 3D-micro parts while keeping using a layer-by-layer approach. Each layer can be given a specific structure. They will be printed and contain channels and cavities that are open or filled in a very high precision manner. The micro device will have as basic building material ceramics, which is a clear advantage in applications that require high temperature, aggressive environments, specific dielectric material, low thermal conductivity and long time reliability. Furthermore, it will allow details on it with spatial resolutions under 10 μm and the ceramics tapes developed could be as thin as 10 μm.