Micro Systems Engineering (MSE)

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Micro Systems Engineering, has been dedicated to further developing hybrid technology for highly reliable electronic circuits for over 23 years. the company is among Europe’s technological architects in the field of substrate and interconnection technology. In 1995 the LTCC-technology as a new division was introduced in MSE. Today MSE can offer their expertise in the design and manufacturing of LTCC-based modules for customers. Beside an advanced substrate technology especially LTCC multi layer ceramic substrates, MSE offers the complete service from circuit design to the final module assembly. Development programs include fine line structuring for high density interconnect substrates and the introduction of Flip Chip and Chip Scale Package technology for automated assembly, higher integration and increased electrical performance. MSE provides a large variety of hybrid and multi chip modules for the following applications: Medical Electronics, Aerospace Electronics, Communication Systems, Industrial Electronics, RF- and Micro-Wave Applications. Since 1994 MSE is certified according ISO 9001.MSE has a lot of experience in manufacturing LTCC substrates. 80 µm lines and spaces have been realized commercially, 50 µm lines and below in dedicated areas have been manufactured for prototypes and samples and became standard. Multilayer substrates with a layer number of 20 and more have been manufactured already and embedded passive components (resistors, capacitors etc.) are commercialized.

Description of the department involved in the project: The Substrate Engineering Department is in charge of process establishing and product realization within the company. The whole technical realisation of LTCC as well as thick film products is running in this department. The experienced engineering staff is also responsible to keep the technology to the leading edge. Therefore in this department all relevant activities transferred from the MULTILAYER project will be handled and transferred to manufacturability.

Contact person: Dr. Dieter Schwanke
Website: http://www.mse-microelectronics.de

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