Micro-Fluidics Interest Group

In the column on the right you will find useful information about the manufacturing of micro-fluidic devices.

Below you will find recent posts on the 4M Association which are considered to be of interest to the Micro-fluidics Interest Group.

Glass

material properties:
thermal stability up to: misc. <500 °C
most relevant chemical non-resistance: HF
optical transparency: yes

dimensions:
min. hole diameter: 100 micron
aspect ratio: not applicable because inclined sidewalls

SU-8 Photoresist

material properties:
thermal stability up to ~200 °C chemically (but stress condition may change)
most relevant chemical non-resistance: NMP, piranha etch solution

process parameters:
temperature: soft bake, PEB & hard bake in the range 65 °C - 150 °C
exposure wavelength: broad band
used chemicals: EC developer

dimensions:
min. hole diameter: >10 µm
aspect ratio: 5 for large hole diameter

Silicon (Si)

dimensions:
min. hole diameter: 200 nm- 500 nm

Ordyl Dryfilm Resist

material properties:
most relevant chemical non-resistance: acetone

process parameters:
exposure wavelength: 365 nm
used chemicals: isopropanole, acetone for wafercleaning

DuPont PerMX 3020 dryfilm resist

material properties:
thermal stability up to 220 °C
most relevant chemical non-resistance: acetone

process parameters:
temperature: max. 95 °C
exposure wavelength: 365 nm
used chemicals: isopropanole, acetone for wafercleaning
aspect ratio: 04:01

4th congress on Micro and Nano Manufacturing

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

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Micro-Fluidics Interest Group

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