Micro-Fluidics Interest Group

In the column on the right you will find useful information about the manufacturing of micro-fluidic devices.

Below you will find recent posts on the 4M Association which are considered to be of interest to the Micro-fluidics Interest Group.

Process Details

used materials: COC, PMMA, PC

dimensions:
min. structure wide: 20 µm
aspect ratio: 5

Process Details

used material: Poly-Ethyl-Ether-Ketone

dimensions:
min. structure wide: a hundred micrometers
aspect ratio: 1

Gold (Au), Nickel (Ni)

dimensions:
layer thickness: Ni: a few hundred µm; gold: µm

Nickel-Cobalt (NiCo)

material properties:
thermal stability up to 400°C
most relevant chemical non-resistance: nitric acid
optical transparency: no

process parameters:
temperature: 40°C
used chemicals: nickel and cobalt sulphate
layer thickness: unlimited

Copper (Cu)

material properties:
thermal stability up to 250°C
most relevant chemical non-resistance: nitric acid
optical transparency: no

process parameters:
temperature: 25°C
used chemicals: copper sulphate
layer thickness: unlimited

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Micro-Fluidics Interest Group

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