Micro-Fluidics Interest Group

In the column on the right you will find useful information about the manufacturing of micro-fluidic devices.

Below you will find recent posts on the 4M Association which are considered to be of interest to the Micro-fluidics Interest Group.

Process Details

used materials: various

process parameters:
temperature: roomtemp. - 150 °C
used chemicals: several epoxy adhesives or several conducting adhesives

Process Details

used material: Silica (SiO2)

material properties:
thermal stability up to 1723 °C
most relevant chemical non-resistance: HF

process parameters:
temperature: 900 to 1050 °C
used chemicals: O2, N2 (inert gas)
layer thickness several 100th nm

Process Details

used material: Doped Silicon

dimensions:
min. structure wide: 100µm
wire from 50 to 250 µm

Process Details

used materials: WJ: Copper (Cu) and 42CrMo4; EMD: Steel

process parameters:
temperature: 20 °C
min. structure wide: WJ: 200 µm, EDM: 10 µm
aspect ratio: 50

Process Details

used materials: Different Photopolymers

material properties:
most relevant chemical non-resistance: acetone, KOH
optical transparency: different

dimensions:
min. structure wide: x, y: 10µm, z: 100µm
aspect ratio: different, depends on hole diameter

WCMNM2018

WCMNM 2018 Sponsors

4M/IWMF2016 Conference

Forthcoming Events

  • No upcoming events available

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

User login

Micro-Fluidics Interest Group

  • You must login in order to post into this group.