Micro-Fluidics Interest Group

In the column on the right you will find useful information about the manufacturing of micro-fluidic devices.

Below you will find recent posts on the 4M Association which are considered to be of interest to the Micro-fluidics Interest Group.

Roll laminating

In roll laminating, two polymer foils are bonded. Usually one of them is structured and the other one just serves to seal the microchannels. Roll laminating is a continuous process and therefore suitable for mass production. The rolls of foil are unwound during the process and pressed together. High temperature and pressure are usually necessary but variable. Optionally, chemical agents may be added. As a result the foils are bonded and the single structures can be cut out.

Anodic bonding

Anodic bonding is the bonding of two substrates , usually glass and silicon, by an electrical potential. The substrates are placed between two electrodes and at temperatures around 400° C a high potential (around 1 kV) is applied to the substrates. This forces sodium ions in the glass to move away from the bonding surface. Therefore the surface is highly reactive and bonds easily to the other substrate.

Adhesive bonding

Adhesive Bonding is a modern joining process in which a liquid or semi liquid substance is applied to adjoining work pieces to provide a long lasting bond. This process is highly useful in bonding dis-similar materials that can not be welded. Materials that have the ability to be bonded together are virtually unlimited. Adhesives used in bonding can exist in many forms and be made from various natural and/or artificial compounds. A hindrance to this process is that adhesive bonds are not instantaneous such as welding or nailing. Adhesive bonds take more time to process, in order to allow the adhesives to cure.

from the wikipedia article on Adhesive Bonding

Thermal oxidation

In microfabrication, thermal oxidation is a way to produce a thin layer of oxide on the surface of a wafer. The technique forces an oxidizing agent to diffuse into the wafer at high temperature and react with it. The rate of oxide growth is often predicted by the Deal-Grove model. Thermal oxidation may be applied to different materials.

Chemical vapour deposition

Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. In a typical CVD process, the substrate (e.g. a wafer) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber. Plasma-Enhanced CVD (PECVD) processes use a plasma to enhance chemical reaction rates of the precursors. PECVD processing allows deposition at lower temperatures, which is often critical in the manufacture of semiconductors.

4th congress on Micro and Nano Manufacturing

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

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