Process Details

used material: Silica (SiO2)

material properties:
thermal stability up to 1723 °C
most relevant chemical non-resistance: HF

process parameters:
temperature: 900 to 1050 °C
used chemicals: O2, N2 (inert gas)
layer thickness several 100th nm

Contact:

RAL

Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom

phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk

4th congress on Micro and Nano Manufacturing

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

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