Copper (Cu)

material properties:
thermal stability up to 250°C
most relevant chemical non-resistance: nitric acid
optical transparency: no

process parameters:
temperature: 25°C
used chemicals: copper sulphate
layer thickness: unlimited

Contact:

DTU

Technical University of Denmark (DTU)
"Department of Manufacturing Engineering and Management Materials Technology"
Dr. Peter T. Tang
Produktionstorvet, DTU, building 427S
DK-2800 Kgs. Lyngby
Denmark

phone: +45 45 25 48 04
tt@ipl.dtu.dk

4th congress on Micro and Nano Manufacturing

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

User login

Micro-Fluidics Interest Group

  • You must login in order to post into this group.