Au, Cu, Al, Ti, Cr, Si3N4, SiO2, TlO2

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Micro-Fluidics Interest Group Au, Cu, Al, Ti, Cr, Si3N4, SiO2, TlO2 process parameters: temperature: <60°C dimensions: layer thickness: 10 nm - 1µm Contact: FEMTO-ST CNRS-FEMTO-ST Dpt. LPMO Dr. Chantal Khan Malek 32 Av. de l' Observatoire 25044 Besancon France phone: +33 (0)3 81 85 39 35 chantal.khan-malek@femto-st.fr ‹ Thermal evaporation up Chromium (Cr) › Printer-friendly version	4th congress on Micro and Nano Manufacturing Manufacturing Micro-Fluidics Structuring Deposition techniques Bonding Creating holes Metallization Currentless deposition Electroplating Screen printing Sputtering Thermal evaporation Au, Cu, Al, Ti, Cr, Si3N4, SiO2, TlO2 Chromium (Cr) Gold (Au) Surface modification Micro dispensing Micromachines - Supporting the 4M Association MDPI - Supporting the 4M Association
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4th congress on Micro and Nano Manufacturing