MID

9th International MID Congress

29/09/2010
30/09/2010

The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID).

4th congress on Micro and Nano Manufacturing

Micromachines - Supporting the 4M Association

MDPI - Supporting the 4M Association

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